The PiezoFlare 800 is a manually operated PLD system.
This equipment can hold up to 4 different targets and can process any wafer or substrate size below a diameter of 200 mm (or 150 mm square).
The source of the Pulsed Laser process is an 80 Watt Excimer laser with a fully automated beam delivery system. The tool has been designed for ease of maintenance with a high standard of reproducibility and stability.
The reactor can process in a vacuum environment with a temperature ranging from 25 up to 800 °C with background gasses as N2, O2, or Ar and on request additional gasses are possible.